Our Technology
Thermowafer's precision thermal management platform enables next-generation semiconductor performance through wafer-scale cryogenic integration.
Core Technology
Embedded Microchannel Cooling
Integrated cooling channels at the junction level enable direct heat extraction with exceptional efficiency. Handles heat fluxes up to 1200 W/cm².
Advanced Materials
Leverages high-thermal-conductivity materials (boron arsenide, engineered composites) with optimized interface engineering.
Dynamic Thermal Management
Electrically controlled heat flow enables real-time thermal optimization, adapting to device workload and operating conditions.
MEMS Micro-Compression
Resonant micromechanical actuation generates pressure ratios and mass-flow rates engineered for continuous operation under demanding thermal and mechanical loads.
Cryogenic Integration
Precision wafer-scale cryogenic cooling enables localized temperature reduction at the junction, unlocking new performance tiers.
Hermetic Packaging
Active pressure and vacuum control with wafer-level packaging ensures stable micro-environments and long-term reliability.
Key Capabilities
Micrometer-Scale Precision
Our thermal management operates at the scale where heat is generated—within semiconductor junctions. This enables unprecedented control and efficiency.
- Channel dimensions in the micrometer range
- Direct junction-level heat extraction
- Minimal thermal resistance
Integration-Ready Design
Engineered for seamless integration into proprietary hardware without requiring fundamental redesigns. Compatible with existing semiconductor manufacturing processes.
- Modular architecture
- Standard interface specifications
- Production-scalable fabrication
Performance Optimization
By removing thermal constraints, Thermowafer enables higher clock speeds, increased power efficiency, and extended device lifespan.
- 5-10°C temperature reduction
- Improved reliability and longevity
- Enables next-generation performance tiers
Performance Metrics
5-10°C
Temperature Reduction
per junction
1200+
Heat Flux Handling
W/cm²
~5%
Reliability Improvement
per °C reduction
30-50%
Cooling Efficiency
data center power savings