Assigned maturity
TRL 2
Concept / application formulated
Wafer-scale MEMS micro-compressor and integrated cryogenic thermal-management platform
Core semiconductor cooling technology
Current basis
The platform concept and its intended application have been formulated. Current work emphasizes high-fidelity multiphysics simulation, resonant MEMS architecture optimization, and engineering of the enabling subsystem for chip-level cryogenic cooling.
Why not TRL 3 yet
Thermowafer is not presenting this platform as having completed experimental critical-function proof of concept. Advancing beyond TRL 2 requires documented analytical and experimental evidence validating the relevant key parameters.
